• 天业工程机械
  • 天业工程机械
  • 天业工程机械

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The term Transistor Outline package (more commonly referred to as TO),always consists of two components: a TO header and a TO cap. While the TO header makes sure that the encapsulated components are provided with power, the cap ensures the smooth transmission of optical signals. This includes the transmitters (e.g. laser diodes) as well as the receivers of the optical signals (e.g. photodiodes).


The TO header provides a mechanical basis for the installation of electronic and optical components such as semiconductors, laser diodes or simple electronic circuits, while at the same time providing power to the encapsulated components with the aid of pins. Optical components in TO packages such as photodiodes and laser diodes are particularly susceptible to damage from their environment. Humidity in particular, can cause semiconductor elements to corrode rapidly, leading to failure of the entire component. This is why these TO header components require reliable and permanent protection.


Our products cover TO56, TO46, TO38, TO33 for different kinds of transmitters and receivers package form, aiming different application, available for EML, DML, DFB, FP, VCSEL, PD, PIN-TIA, Super-TIA, APD-TIA, Ball Lens, Aspherial Lens, Flat Window, bit rate from 1G to 25G.



COB (known as Chip-on-Board) is semi-conductor assembly technology where micro-chip also known as die is electrically interconnected instead of using traditional assembly process or individual IC packaging on the final product board. The chip is usually covered with a coating of epoxy or resin to protect it the way a heatsink does, as well as protecting the chips and wires from damage


COB process consists of three main categories to perform when manufacturing the Chip-on-Board. The first process is ‘die mount or die attach’, the second is ‘wire bonding’ and lastly ‘the encapsulation of die wires’.


The advantages of COB include:

Better performance due to deceased interconnection between length and resistance.
Better protection against reverse engineering;
Reduced space and cost;
Shorter time to the market.
Higher reliability with better heat dispatch and small number of solder joint.
Improved output efficiency of LED lighting
Avoid photonic absorption and scattering over the pocket wall. 

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